A, LED Package Type
(A) of the plug-in (ThroughHole)
1, the phase line both sides of the vertical leads: Ceramic Frit ceramic dual in line plastic dual dual-metal dual in plastic shrink-type plastic shrink dual in body double row
2, lead Stretch both sides leads to: ceramic flat ceramic flat metal melting plastic sealing flat flat
3, the underside of the vertical wire leads: plastic single plastic "Z"-shaped metal wire metal four sides of circular metal diamond metal gate leads round ceramic pin plastic pin grid formation formation
4, the lead single vertical leads: one side leads to a flat metal wire bent-lead plastic single
(B) surface-mount (SurfaceMount)
1, the lead side of the wing leads to: plastic small outline plastic wing wing leaded chip carrier ceramic leaded chip carrier
2, the lead side of the "J" shaped leads: plastic small outline plastic "J" shaped ceramic leaded chip carrier "J"-lead plastic chip carrier against "J" shaped ceramic leaded chip carrier against "J"-lead chip vector
3, the lead four Stretch leads: lead plastic quad flat four-lead ceramic flat
4, ceramic leadless chip carrier
(C) direct bonding (DirectBonding)
1, flip-chip package
2, Chip Plate Package
3, tape automated packaging
Second, the package name
State the name and on behalf of the existing letters IC package 1, F-type ceramic flat package; 2 flat ceramic package sealed H-melting; 3-D ceramic double row package; 4, a double row of ceramic Frit J-type packaging; 5 plastic dual in P-type package; 6, T-encapsulated metal circle; 7, K-metal diamond package; 8, O-plastic small outline package; 9, Plastic Chip Carrier Package-E; 10-lead plastic quad flat N-type package; 11, ceramic chip carrier packages-C; 12-pin ceramic package G-gate formation; 13, four-lead ceramic flat package Q-type; 14, W-glass ceramic flat package; 15, metal double row package M-; 16, Ms-type metal four packages; 17 Mb metal flat package type; 18, package Ts circular metal edges lead type; 19 Ft separate package type conformal coating; 20, double row infusion package type Gf ;
Note: (1) Section 14 of the glass ceramic flat package is not included in the national standards;
(2) 15 ~ 20 packages only for hybrid integrated circuits and film integrated circuits.
Third, the package code
Package code consists of four or five parts. The first part is the letter, said packaging material and structure, that is the package name; the second part is Arabic, said the terminal number (less than 10 leads should be a bit before adding 0); the third part of the letters or numbers composed of similar products that package size or shape of the main differences; fourth part with numbers, that minor differences in size; the fifth part of the use of letters, that the structural differences.
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