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Bonding wires: gold content ≥ 99.99%, trace elements added sum <0.01%. With that in high temperature, high speed bonding, smooth surface, welded into the ball, good corrosion resistance, conductivity and bonding superior performance characteristics, adapted to high temperature, high-speed, very high-speed devices. Are widely used in integrated circuit (IC) large-scale integrated circuit (LSI) industry, is an important material for microelectronics industry, as the connection between chip and lead frame line. LED LED market, gold is the most widely used welding industry materials, performance, unmatched by other welding materials, mainly for the size of LED power, launch control, patch, IC bonding, the main parameters of line 16, 17 line 18 line 19 line 20 line 22 line 23 line 24 line 25 line 28 line 30 line 32 line such as a product introduction is a key alloy wire has excellent electrical, thermal, excellent mechanical properties and chemical stability of materials within the lead, mainly as a key semiconductor packaging materials
LED high-quality gold
