szbaiyuanxiang

Model 4 inch brand Baixiang source / 6 inch / 8 inch extension aliases film machine, wafer machine expansion, expansion chip light-emitting diodes are widely used in machine use, small and medium-power transistors, integrated circuits and special semiconductor devices, a manufacturer, machine expanded use of the expansion of crystal machine, also known as wafer film machines or expansion machine. Is widely used in light-emitting diodes, small and medium-power transistor, backlight, LED, integrated circuits and semiconductor devices produced in a number of special grain expansion process. It is tightly packed LED chips evenly separated to better implant welding workpiece. It uses LED film heating plasticity, dual cylinder up and down control, single LED chip to evenly spread around, to the satisfaction of the chip automatically after forming the gap, the diaphragm tension unchanged line. Temperature design, simple operation. Second, the machine features: ① double cylinder up and down control; ② constant temperature design, even a modest expansion of the surrounding membrane; ③ heating, stretching, expanding crystal, solid film at once; ④ heating temperature, the expansion time, adjustable uniform rate of return; ⑤ easy to operate, single-class yield. High-quality machine parts, used parts are processed using high-strength aluminum alloy and stainless steel to ensure durability of the equipment; temperature control device uses the original Yu-electric PID intelligent temperature controller. Third, the technical parameters: 1. Power supply voltage: 220VAC (50Hz) ± 10% 2. Working pressure: 4Kg/cm2 3. Temperature range: room temperature ~ 100 ℃ 4. On the cylinder stroke: 200mm 5. Under the cylinder stroke: 100mm (can be two-way adjustable) 6. Expansion diameter: 4 inches, 6 inches (7 inches, 8 inches, 10 inches to be ordered) 7. Dimensions: 270x220x920mm (L x W x H) 8. Weight: 20Kg four steps: 1. Plug, quick coupler connected to the high-pressure tracheal tube; 2. Turn the power switch, the temperature set at 55 ℃ (temperature difference between persons of different chip film 5 ℃); 3. The cylinder on the switch to "up" position, the die back to the top, switch to the next cylinder down position, the next die back to the bottom (repeated several times under the cylinder moves, the speed will increase the speed adjusted to fit ) 4. Release the lock, set off on the workpiece plate, first put on the expansion of the inner ring under the crystal on the die, and then stick with the chip turned up the next piece crystal film center, chip side up, cover the plate on the workpiece, Tighten the lock. 5. Cylinder switch to the next "up" position, the next rising slowly die, the film began to spread around, the grain gradually widening the interval, when spread to the chip interval of 2 to 3 times the original when it is stopped rising, will be extended to crystal ring rounded down flat on the outer and inner membrane just above. 6. The cylinder on the switch to "down" position, the die down, the spread of the crystal film set tight turn position on the die back to the top. 7. Switch to the next cylinder "down" position, the next drop to the bottom die, turn out to expand the crystal grain finished film, trim the excess membrane surface, sending plastic solid crystal prepared under the process. Fifth, maintenance: 1. Attached with a clean cloth to wipe dust, oil moving parts regularly painted a little lubrication; 2. Crystal film placed on the location of turn must be clean, grease and dirt attached to contaminate wafers, resulting in defective products. VI Notes: 1. Do not work the cylinder or into the hands pressed together near the surface; 2. Die under the surface Do not use sharp percussion, friction, so as to prevent injuries; 3. Machine installation, should be properly grounded; 4. Chassis power dangerous, do not touch; 5. Replace heating pipe, or other electrical components, the need to unplug the power cord before proceeding with time; 6. Do not use cloth with water or solvent cleaning machine, to avoid leakage or a fire hazard.